Editor’s note: This article is the second in a series to help practitioners learn about the AICPA’s new quality management standards and prepare to implement them. The interrelated final standards on ...

The interrelated final standards on quality management issued in June 2022 by the AICPA’s Auditing Standards Board and Accounting and Review Services Committee are intended to clarify and improve ...

One of the biggest changes in the 2020 FCPA Resource Guide, 2nd edition, is the addition of a new Hallmark, entitled, Investigation, Analysis, and Remediation of Misconduct, which reads in full: The ...

The 2023 ECCP re-emphasized the need for both performing a root cause analysis but equally importantly using it to remediate your compliance program. It stated, “a hallmark of a compliance program ...

Root-cause analysis is core to problem-solving across many fields. From hospitals searching for patient safety issues to engineers diagnosing faults in complex machinery, finding the source of a ...

When there’s a major systems outage or performance issue, IT teams come to the rescue to restore services as quickly as possible. Some IT organizations follow IT service management (ITSM) incident ...

UChicago Medicine is one of 12 hospitals in the nation with a 26-year, Leapfrog straight-“A” streak and Stephen Weber, MD, said the secret is to never be satisfied. “Whether I’m seeing patients or ...

When it comes to quality and safety improvement, healthcare leaders spend plenty of time analyzing adverse events and what led up to an unfavorable outcome. At NYC Health + Hospitals, leaders are ...

Two expectations informed end-users have of electric motor service centers are reliable best practice repairs and root cause failure analysis (RCFA) to prevent recurring failures. Service centers ...

Traditionally APM relied on engineers building dashboards, logging and manual systems to trace performance issues. In the current age, the ever growing modern architectures make this approach ...

The semiconductor industry is undergoing a profound transformation. What once centered on single-die silicon packaged in QFN or BGA formats has evolved into a landscape of multi-die integration, ...