The demand for high-performance devices, particularly in AI, HPC, and data centers, has surged dramatically in the ever-evolving landscape of integrated circuit technology. This demand has been ...

Major processes in semiconductor wafer fabrication: 1) wafer preparation, 2) pattern transfer, 3) doping, 4) deposition, 5) etching, and 6) packaging. The process of creating semiconductors can be ...

New portfolio drives chip performance with panel-based interconnect innovation KLA is extending the capability of the proven Corus™ direct imaging platform and introducing the Serena™ direct imaging ...

Much has been written in the past few months about the upcoming sunset of Moore’s Law. Stated succinctly, Gordon Moore predicted in 1965 that the number of transistors in ICs would double every 12 ...

Trymax Semiconductor B.V. provides plasma-based etching, stripping, and curing process equipment for advanced semiconductor ...

Semiconductor materials distributors are optimistic about operations in the second quarter of 2024, driven by rising semiconductor capacity and long-term demand for AI and High-Performance Computing ...

IC packaging is a technique for shielding semiconductor equipment from ambient physical damage or degradation by wrapping them in ceramics or polymer packaging materials. There are several varieties ...

Arteris, Inc. has announced the launch of Magillem Packaging, a new software aimed at simplifying and accelerating the chip design process, particularly for advanced technologies in AI and edge ...

Advanced packaging that’s no bigger than the die itself brings together high performance and high reliability with small size and low cost. Not so long ago, defense and aerospace applications were the ...

Bumping technologies for advanced semiconductor packaging have evolved significantly to address the challenges posed by shrinking contact pitches and the limitations associated with conventional ...

Amkor's S-SWIFT packaging technology addresses advanced IC packaging challenges through an embedded trace RDL process, providing higher bandwidth die-to-die interconnects for AI, HPC, and data center ...