AI models trained on the mathematics of physical systems are accelerating engineering design by approximating complex simulations in seconds, offering significant speed gains over traditional solvers.

IC packaging, typically an afterthought in the design of a new-generation SoC, is particularly troublesome for communications circuits and high-speed interface circuits. Everyone wants small size and ...

AI models trained on physical principles are starting to replace or complement traditional simulations in sectors such as automotive, aerospace, and semiconductors. These large physics models can ...

Microelectromechanical systems (MEMS) are rapidly becoming an indispensable part of the design and fabrication of intelligent systems. Bridging the gap between the physical world and the electronic ...

A layout-dependent circuit-design model from Toshiba helps boost gate density and improve cost-performance in next-generation 45-nm CMOS technology. More specifically, 45-nm CMOS gate density can be 2 ...

Built into CU Boulder’s budget allocation model is a formal review conducted every 3-5 years. This review practice ensures the model works as intended, advancing the alignment of our resources to our ...