Optics

Redefining Wafer-Level Packaging Production with Heidelberg Instruments Flexible Direct Writing Technology

Heidelberg, Germany – Heidelberg Instruments, a global player in direct write technology and solution provider for the advanced packaging market, is transforming the semiconductor industry with its ...
Digi Times

Samsung steps up fan-out wafer-level packaging deployment

Samsung Electronics has stepped up its deployment in the fan-out (FO) wafer-level packaging segment with plans to set up related production lines in Japan, according to industry sources. Samsung has ...
Morningstar

Nordson Electronics Solutions to Exhibit High-Yield Fluid Dispensing Technologies for Panel-Level and Wafer-Level Packaging at SEMICON Taiwan 2025

Nordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, will demonstrate their latest equipment for semiconductor manufacturing at SEMICON Taiwan 2025, ...

Thin Wafers Market Trends and Investment Opportunities, 2026-2030 & 2035: Innovations in Wafer-Level Manufacturing Driving Growth

The "Thin Wafer Market Report 2026" has been added to ResearchAndMarkets.com's offering.The thin wafer market is experiencing robust growth, poised to expand from $12.57 billion in 2025 to $19.45 ...
Fudzilla

TSMC gets fan-out (InFO) wafer-level packaging

All ready for 2016 TSMC is scheduled to move its integrated fan-out (InFO) wafer-level packaging technology to volume production in the second quarter of 2016. Apparently the fruity cargo cult… TSMC ...
TweakTown

Apple iPhone 18 with A20 chip could switch to wafer-level multi-chip module packaging

TL;DR: Apple's iPhone 18 will feature the next-gen A20 chip using TSMC's advanced WMCM packaging with MUF technology, enhancing efficiency and yield. Eternal secured a major contract as a packaging ...
Digi Times

Samsung aims to meet Tesla's chip packaging demand with new panel-level technology

Samsung Electronics is advancing development of its next-generation System-on-Panel (SoP) packaging technology, aiming to produce modules significantly larger than those possible with conventional ...
Seeking Alpha

NVE outlines accelerated growth plans with in-house wafer-level chip scale packaging and 4% sequential revenue increase

CEO Daniel Baker reported a 4% sequential increase in revenue for the quarter, highlighting strong increases in distributor and nondefense sales, despite an expected decrease in defense sales. Baker ...
Business Wire

Research and Markets: Global Wafer-level Packaging Equipment Market 2014-2018 with Applied Materials, Disco, EV Group, Tokyo Electron & Tokyo Seimitsu Dominating

DUBLIN--(BUSINESS WIRE)--Research and Markets (http://www.researchandmarkets.com/research/s9zs8w/global) has announced the addition of the "Global Wafer-level ...
Electronic Design

STMicroelectronics, STATS ChipPAC, And Infineon Join Forces On Wafer-Level-Packaging

Semiconductor makers STMicroelectronics and Infineon have teamed with 3D packaging provider STATS ChipPAC to jointly develop the next generation of embedded Wafer-Level Ball Grid Array (eWLB) ...
Seeking Alpha

Aehr Test Systems and ISE Labs Announce Partnership on Wafer-Level Test and Burn-in for High-Performance Computing and Artificial Intelligence Processors

FREMONT, CA / ACCESS Newswire / November 3, 2025 / Aehr Test Systems (AEHR), a worldwide supplier of semiconductor test and burn-in solutions, today announced a strategic partnership with ISE Labs, ...