In the age of Industry 4.0, manufacturers are expected to develop increasingly sophisticated, digitally integrated products while controlling development costs and accelerating time to market.
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Abstract: As the integrated chip packaging technology progresses from 2.5-D to 3-D, new issues arise regarding the reliability of interconnects. The analysis of interconnect reliability is inherently ...
Nominate your scientific computing stars for the inaugural SCW75 – an annual recognition programme celebrating the individuals driving innovation at the intersection of computing and scientific ...
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