We just reported that the AMD Ryzen AI Embedded P100 series has been expanded with six additional SKUs, and, timed with that, SolidRun has announced ...
Michal studies Automotive Journalism at Coventry University in the UK, and has been writing for CarBuzz since March 2025. He was nominated for student culture piece of the year recently and has been ...
Abstract: Fatigue-induced delamination of the direct-bonded copper (DBC) solder layer is a critical and latent failure mode in multichip Insulated Gate Bipolar Transistor (IGBT) power modules. To ...
Abstract: A health monitoring framework which enables the detection of wire-bond lift-offs and thermal degradation due to solder fatigue in IGBT power modules is presented in this paper. The framework ...
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