Abstract: Through-silicon via (TSV) has attracted much attention due to its numerous advantages, including high-density interconnection, low power consumption, and wide bandwidth. When signals are ...

Abstract: This research work introduces a clustering-based in-place sorting algorithm, cluster sort. It is designed in such a way that it improves sorting efficiency by using data locality. It works ...

AI hardware needs to become more brain-like to meet the growing energy demands of real-world applications, according to researchers. In a study published in Frontiers in Science, scientists from ...