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Abstract: This article studies the two-dimensional (2-D) rectangle packing area minimization problem (RPAMP), a key subproblem in floor planning for very large-scale integration (VLSI) chip design.
1 Electric Power Research Institute of Guizhou Power Grid Co., Ltd., Guiyang, China 2 XJ Electric Co., Ltd., Xuchang, China With the advantages of simple topology, voltage matching, electrical ...
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